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2023-04-19
Raw materials for chips
1. The raw material for chips is silicon, which is refined from quartz sand and purified with silicon element (99.999%). Then, pure silicon is made into silicon crystal rods, which become the material for manufacturing quartz semiconductors in integrated circuits. Slicing them is the specific wafer required for chip manufacturing
2. Wafer coating: Wafer coating can resist oxidation and temperature resistance, and its material is a type of photoresist.
3. Wafer photolithography development and etching process use chemicals sensitive to ultraviolet light, which softens when exposed to ultraviolet light.
. The shape of the chip can be obtained by controlling the position of the shading material. Apply photoresist to silicon wafers to dissolve them when exposed to ultraviolet light At this point, the first portion of the sunshade can be used to dissolve the portion directly exposed to ultraviolet light, which can then be washed away with a solvent. The remaining part will have the same shape as the shading material, and this effect is exactly what we want. This will obtain the silicon dioxide layer we need4. Impurities will be added
to implant ions into the wafer, generating corresponding P and N type semiconductors. The specific process is to start from the exposed area on the silicon wafer and place it in a chemical ion mixture This process will change the conductivity of the impurity exchange area, allowing each transistor to be on, off, or carry data. A simple chip can only use one layer, but a complex chip usually has many layers. At this point, the process is repeated continuously, and different layers can be connected through an open window. This is similar to the manufacturing principle of multi-layer PCB boards. More complex chips may require multiple silicon dioxide layers, which are achieved through repeated lithography and the above process to form a three-dimensional structure
5. Wafer Testing
After the above processes, lattice like grains are formed on the wafer.
. Conduct electrical characteristic testing on each grain through needle testing6. Packaging
After manufacturing, the wafer is fixed, pins are bound, and various packaging forms are made according to requirements. This is why the same chip core can have different packaging forms
7. Testing and Packaging
After the above process flow, the chip production has been completed. This step involves testing the chip, removing defective products, and packaging.